Semiconductor & Microelectronics
UHV-grade, cleanroom-compatible hermetic assemblies for advanced semiconductor packaging and photonic integration.
Precision Packaging for Semiconductor Innovation
Advanced Hermetic Solutions provides high-performance hermetic packaging for microelectronic and semiconductor applications. Our capabilities support vacuum-sealed and cleanroom-assembled packages for optoelectronics, MEMS, photonics, ICs, and sensors. We fabricate high-tolerance assemblies with robust thermal and electrical stability, engineered to meet demanding performance and environmental standards.
- UHV-rated ceramic and metal packages with low outgassing alloys
- High pin-count electrical feedthroughs and micro-coaxial headers
- Sapphire or optical-grade window integration for photonic applications
- Thin film, MEMS-compatible submounts and fixtures
- Cleanroom packaging and ESD-controlled handling available
We partner with fabless designers, OEMs, and research labs developing next-generation IC packaging and custom vacuum enclosures.
Application Areas
- MEMS Devices: Ceramic and metal packages for pressure, inertial, and RF MEMS sensors
- Photonics & Optoelectronics: Hermetic housings for VCSELs, LiDAR, IR sensors, and optical communications
- Semiconductor Lasers: High-reliability brazed mounts with thermal management features
- Vacuum Electronics: UHV enclosures with integrated electrodes, viewports, and getters
- Custom IC Packaging: Hermetic lids and multi-layer ceramic packages with Kovar or Alloy 42 seals
Need Custom Packaging for a Semiconductor Device?
We’ll help you design and build reliable microelectronic assemblies tailored for cleanroom integration and extreme environments.
Talk to Our Engineers